JPS6314464Y2 - - Google Patents
Info
- Publication number
- JPS6314464Y2 JPS6314464Y2 JP10711981U JP10711981U JPS6314464Y2 JP S6314464 Y2 JPS6314464 Y2 JP S6314464Y2 JP 10711981 U JP10711981 U JP 10711981U JP 10711981 U JP10711981 U JP 10711981U JP S6314464 Y2 JPS6314464 Y2 JP S6314464Y2
- Authority
- JP
- Japan
- Prior art keywords
- electrodes
- substrate
- circuit board
- external connection
- electric circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 21
- 239000004065 semiconductor Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000012050 conventional carrier Substances 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004801 process automation Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10711981U JPS5812956U (ja) | 1981-07-17 | 1981-07-17 | 電気回路用基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10711981U JPS5812956U (ja) | 1981-07-17 | 1981-07-17 | 電気回路用基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5812956U JPS5812956U (ja) | 1983-01-27 |
| JPS6314464Y2 true JPS6314464Y2 (en]) | 1988-04-22 |
Family
ID=29901565
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10711981U Granted JPS5812956U (ja) | 1981-07-17 | 1981-07-17 | 電気回路用基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5812956U (en]) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60171747A (ja) * | 1984-02-17 | 1985-09-05 | Hitachi Micro Comput Eng Ltd | 半導体装置 |
-
1981
- 1981-07-17 JP JP10711981U patent/JPS5812956U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5812956U (ja) | 1983-01-27 |
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